http://apps.mnc.umn.edu/pub/photoresists/az9200_pds.pdf http://www.nano.pitt.edu/sites/default/files/MSDS/Resists/AZ_P4620_Photoresist_MSDS.pdf
Analysis of Shipley Microposit Remover 1165 and
WebMATERIAL SAFETY DATA SHEET AZ P4620 Photoresist Substance key: BBG70J7 RÈVISION ÖATE: 07/05/2005 Print Date: 07/05/2005 Version 1 Section 05 - Treatement: Fire fighting measures Flash point: Suitable extinguishing media: Special fire fighting procedure: Specific hazards during fire fighting: Unusual fire and explosion hazards: … WebAZ P4620 Photoresist (Gallon) AZ P4903 Photoresist (Gallon) Soft Bake: 110C Expose: g/h/i-line Post Expose Bake: Optional Develop: spray/immersion Develop: AZ 400K 1:3 … fastenal all thread
Home Nano University of Pittsburgh
WebAZ® EBR Solvent or AZ® EBR 70/30 Developers AZ® ®400K 1:3 or 1:4, AZ 421K, AZ Developer 1:1, AZ 340 Removers AZ ® 300T, AZ 400T, AZ Kwik Strip AZ® P4000 … WebIn my experiments, I tried a post bake procedure for a 20 u thick AZ P4620 photoresist spun on a glass slide. i observed that the features were destroyed after the post bake. the post bake was done for 5 min at 120 deg. C. According to the literature, post bake is an optional step for thick photoresist layer and the features may distort due to WebAZ EBR Solvent Prebake 110°C, 50", hotplate Exposure broadband and monochromatic h- and i-line Reversal bake 120°C, 2 min., hotplate (most critical step) Flood exposure > 200 mJ/cm² (uncritical) Development AZ 340, 1:5 (tank, spray) or AZ 726 (puddle) Postbake 120°C, 50s hotplate (optional) Removal AZ 100 Remover, conc. HANDLING ADVISES fastenal airway heights wa